Wednesday, June 5, 2024
Boxboro Regency Hotel & Conference Center, MA
- Planning for UHDI
- New Materials for UHDI & Substrates
- Standards Updates for UHDI
- Making Surfaces Conductive for mSAP and SAP
- Printable Conductive Inks for iSAP
- New Build-up Films
- Direct Imaging of Sub 15μm Features
$295
- 9 Presentations
- Panel Discussion
- Lunch and Evening Reception
- Admittance to PCB East Exhibition
Forum chairman
Gene Weiner
(Weiner International Consulting)
Vice chairmen
Peter Bigelow
(FTG Circuits)
Alun Morgan
(Ventec and EIPC)
Brought to you by the PCEA and the conjunction with PCB East
