Wednesday, June 5, 2024
Boxboro Regency Hotel & Conference Center, MA
  • Planning for UHDI
  • New Materials for UHDI & Substrates
  • Standards Updates for UHDI
  • Making Surfaces Conductive for mSAP and SAP
  • Printable Conductive Inks for iSAP
  • New Build-up Films
  • Direct Imaging of Sub 15μm Features

($295 prior to May 17)

  • 9 Presentations
  • Panel Discussion
  • Lunch and Evening Reception
  • Admittance to PCB East Exhibition

Forum chairman
Gene Weiner
(Weiner International Consulting)
Vice chairmen
Peter Bigelow
(FTG Circuits)
Alun Morgan
(Ventec and EIPC)

Brought to you by the PCEA and in conjunction with PCB East

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