2026 Schedule at a Glance

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9:05 a.m. to 9:15 a.m.
PCBAA Update: Washington Legislative Update
John Vaughan, Summit Interconnect
9:30 a.m. to 10:15 a.m.
Keynote: Build AI vs. Buy AI; Why AI Isn’t a Technology Problem… It’s a Leadership One
Sean Patterson, Cross-Gen AI
10:30 a.m. to 11:15 a.m.
AI Needs Hardware: Rebuilding Advanced PCB Manufacturing
Vytautas Ilgunas, TLT
11:15 a.m. to 12:00 p.m.
AI’s Role in the Future of Electronics Manufacturing Collaboration
Timon Ruban, Luminovo
1:15 p.m. to 2:00 p.m.
Outlook in View of AI Surge in PCB Demand and Severe Material Shortages/Allocations – speaker TBA
2:00 p.m. to 2:45 p.m.
A Solution to Workforce Shortages – speaker TBA
3:00 p.m. to 3:50 p.m.
Keynote 2: Unintended Consequences! How the AI Infrastructure Build Out Will Reshape the PCB Materials Supply Chain
Alun Morgan, Ventec
3:50 p.m. to 4:50 p.m.
Panel Discussion / Q&A
Vytautas Ilgunas, Timon Ruban, Alun Morgan
   
8:30 a.m. to 12:00 p.m
Circuit Grounding to Control Noise and EMI
Rick Hartley, Rhartley Enterprises
8:30 a.m. to 12:00 p.m
DDR Through the Eyes of the Designer
Charlene McCauley, McCauley Design Group, and Terrie Duffy, Dell
8:30 a.m.  to 12:00 p.m.
Designing the Signal Routing to Control Energy in Digital PCBs
Susy Webb, Design Science
1:30 p.m. to 3:30 p.m.
Launching Electronics with Confidence: A Guide to Successful Design Release
Syed Ubaid Ali Warsi, Wavetronix
1:30 p.m. to 3:30 p.m.
SMPS Layout — PCBA Design Practices to Avoid EMI
Gerry Callahan, US Cargo Systems
1:30 p.m. to 3:30 p.m.
Placement Techniques for a New Designer
Kristen Aguiar, Newgrange Design
4:00 p.m. to 5:00 p.m.
No Test, No Rest: A PCB Designer’s Guide to Design for Test
Troy Hopkins, Hopfinity Designs
4:00 p.m. to 5:00 p.m.
Exploring the World of Ultra-High-Density Interconnect (UHDI) PCB Design
Stephen V. Chavez, Siemens
4:00 p.m. to 5:00 p.m.
Basics of Flex Design
Lauren Waslick, Newgrange Design
9:00 a.m. to 11:00 a.m.
Heat Management Strategies through Better Layout
Syed Ubaid Ali Warsi, Wavetronix
9:00 a.m. to 11:00 a.m.
Decoding Design Intent: Making Sense of Inputs to Achieve Better PCB Layouts
Lauren Waslick, Newgrange Design
1:30 p.m. to 3:30 p.m.
The Unsung Hero: Via’s Vital Role in PCB Return Paths
Tomas Chester, Chester Electronic Design, and Rick Hartley, Rhartley Enterprises
1:30 p.m. to 3:30 p.m.
Designing in 3D, Breaking the Mold
Ethan Pierce, Dodec Labs, and Stephan Schmidt, Harting AG
4:00 p.m. to 5:00 p.m.
Designing High Thermal PCBs with Advanced Dielectrics
Chris Parker, TCLAD
4:00 p.m. to 5:00 p.m.
AI Ready Data Standard for PCB Design to Manufacturing Exchange
Hemant Shah, IPC-2581 Consortium and Dana Korf, VGT
9:00 a.m. to 10:00 a.m.
The Most Common Issues Seen in Incoming Designs for PCB Fabrication
Mike Tucker, SCC Shennan China Circuits, and Ray Fugitt, Siemens
1:30 p.m. to 2:30 p.m.
DFM for Ultra High-Density Interconnects (UHDI)
Stephen V. Chavez, Siemens
11:00 a.m. to 12:00 p.m.
Keynote
TBA
10:00 a.m. to 11:00 a.m.
Avoiding the Most Common PCB Design Mistakes: Strategies for First-Pass Success
Ryan Miller, NCAB Group
2:30 p.m. to 3:30 p.m.
The Future of PCB Design — A Conversation about the Next 2-5 Years
Matthew Leary, Newgrange Design
4:00 p.m. to 5:00 p.m.
Libraries: I Hate Them. I Need Them. Help.
Kristen Aguiar, Newgrange Design
9:00 a.m. to 12:30 p.m.
PCB Design for Engineers
Susy Webb, Design Science
9:00 a.m.  to 11:00 a.m.
Differential Pair Routing
Keith Kowal, AMAT
11:00 a.m. to 5:30 p.m.
EMC 101 – Fundamentals
Karen Burnham, EMC United
1:30 p.m. to 3:30 p.m.
Signal Attenuation in Very High Speed Circuits
Rick Hartley, Rhartley Enterprises
4:00 p.m. to 5:30 p.m.
Factors Which Determine PCB Layout Time & Framework for Making the Estimation
Eric Penchansky, Magna International
9:00 a.m. to 12:30 p.m.
PC Board Design for Power Distribution and Decoupling
Rick Hartley, Rhartley Enterprises
9:00 a.m. to 12:30 p.m.
Beyond the Layers: Advanced Techniques for PCB Stack-Up Design
Troy Hopkins, Hopfinity Designs
9:00 a.m. to 12:30 p.m.
From Idea to In-Hand: A Real-World Journey Through PCB Design, Fabrication, and Assembly
Matt Stevenson, ASC Sunstone; Vitaly Michalchuk, Screaming Circuits; and Geoffrey Hazelett, FreedomCAD
2:00 p.m. to 4:00 p.m.
High-Frequency Layout Best Practices for PCBA Design to Avoid EMI
Gerry Callahan, US Cargo Systems
2:00 p.m. to 4:00 p.m.
Using AI in Hardware and PCB Design: Real Strategies to Increase Efficiency and Output
Ethan Pierce, Dodec Labs
2:00 p.m. to 4:00 p.m.
The Design Process: Insights from Multiple Perspectives
Tomas Chester, Chester Electronic Design, and Adam Taylor, Adiuvo Design
   
9:00 a.m. to 9:30 a.m.
Circuit Assembly Basics (morning track)
SMT Printing
Chrys Shea, Shea Engineering, and Antonio Torres, Parmi
9:30 a.m. to 10:00 a.m.
Placement Basics
Daniel Stanphill, Aurora Boardworks
10:00 a.m. to 10:30 a.m.
Reflow Optimization
Paul Lancaster, Heller
11:00 a.m. to 11:30 p.m.
Cleaning
Bill Capen, Honeywell
11:30 a.m. to 12:00 p.m.
Inspection
Antonio Torres, Parmi
12:00 p.m. to 12:30 p.m.
Materials
Anna Lifton, Alpha MacDermid
1:30 p.m. to 2:00 p.m.
Advanced Circuit Assembly (afternoon track)
Stencil Design / Cutting
Elias Malfavon, Metal Etch
2:00 p.m. to 2:30 p.m.
Best and Worst Practices in Printer Setup
Michael Butler, Parmi
2:30 p.m. to 3:00 p.m.
Advanced Solder Pastes – Type 5 and Beyond
Anna Lifton, Alpha MacDermid
3:30 p.m. to 4:00 p.m.
Placement Advancements for AI and Data Center Applications
Daniel Stanphill, Aurora Boardworks
4:00 p.m. to 4:30 p.m.
Reflow Optimization/Formic Acid
Ryan Mayberry, Indium
4:30 p.m. to 5:00 p.m.
Cleanliness Measurement and Conformal Coatings
Doug Pauls, ItDepends
   
9:00 a.m. to 12:30 p.m.
Introduction to the Art of Soldering by Hand- Hand Solder Workshop
Raymond Lawrence, CeTaq Americas
1:30 p.m. to 5:00 p.m.
Introduction to the Art of Soldering by Hand- Hand Solder Workshop
Raymond Lawrence, CeTaq Americas
   
9:00 a.m. to 9:30:00 a.m.
NIST/CUI/CMMC Cybersecurity Journey
Kevin Stone, Foxtronics
9:30 a.m. to 13:00 a.m.
The Lost Art of Auditing
Albert Block, DirectPCB
11:00 a.m. to 12:00 p.m.
Trusted Supplier
Charlie Capers, Zentec
11:30 a.m. to 12:00 a.m.
Future of Defense Electronics Manufacturing
Patrick Daria, DoD Executive Agent
12:00 p.m. to 12:30 p.m.
Equipment Evaluation for Scaling
Bill Capen, Honeywell
1:30 p.m. to 2:00 p.m.
Marketing for Electronics Businesses
Doug Dixon, 360Circuits
2:30 p.m. to 3:00 p.m.
Quality Control and Calibration
Mike Sevigny, CeTaq
3:30 p.m. to 4:00 p.m.
Role of AI in Assembly
Speaker TBA
4:00 p.m. to 5:00 p.m.
Panel Training/Workforce Development
Rebecca Lewis, NextFlex; Lane Glenn, Northern Essex Community College
PCEA Assembly Tracks: Thursday, April 30
 
Basic Circuit Assembly (morning)
9:00 a.m. to 9:30 a.m.
SMT Printing Basics
Chrys Shea, Shea Engineering, and Antonio Torres, Parmi
9:30 a.m. to 10:00 a.m.
Placement Basics
Daniel Stanphill, Aurora Boardworks
10:00 a.m. to 10:30 a.m.
Reflow Optimization
Paul Lancaster, Heller
11 a.m. to 11:30 a.m.
Cleaning
Bill Capen, Honeywell
11:30 a.m. to 12:00 p.m.
Inspection Basics
Antonio Torres, Parmi
12:00 p.m. to 12:30 p.m.
Materials Basics
Anna Lifton, Alpha MacDermid
 
Advanced Circuit Assembly  (afternoon)
1:30 p.m. to 2:00 p.m.
Stencil Design / Cutting
Elias Malfavon, Metal Etch
2:00 p.m. to 2:30 p.m.
Best and Worst Practices in Printer Setup
Michael Butler, Parmi
2:30 p.m. to 3:00 p.m.
Advanced Solder Pastes – Type 5 and Beyond
Anna Lifton, MacDermidAlpha
PCEA Assembly Tracks: Friday, May 1
3:30 p.m. to 4:00 p.m.
Placement Advancements for AI and Data Center Applications
Daniel Stanphill, Aurora Boardworks
4:00 p.m. to 4:30 p.m.
Reflow Optimization / Formic Acid
Ryan Mayberry, Indium
4:30 p.m. to 5:00 p.m.
Cleanliness Measurement and Conformal Coatings
Doug Pauls, ItDepends
9:00 a.m. to 12:30 p.m.
Introduction to the Art of Soldering by Hand- Hand Solder Workshop
Raymond Lawrence, CeTaq Americas
1:00 p.m. to 5:00 p.m.
Introduction to the Art of Soldering by Hand- Hand Solder Workshop
Raymond Lawrence, CeTaq Americas
9:00 a.m. to 9:30:00 a.m.
NIST/CUI/CMMC Cybersecurity Journey
Kevin Stone, Foxtronics
9:30 a.m. to 10:30 a.m.
The Lost Art of Auditing
Albert Block, DirectPCB
10:30 a.m. to 11:00 a.m.
Trusted Supplier
Charlie Capers, Zentech
11:00 a.m. to 11:30 a.m.
Future of Defense Electronics Manufacturing
Patrick Daria, US Executive Agent
12:00 p.m. to 12:30 p.m.
Equipment Evaluation for Scaling
Bill Capen, Honeywell
1:30 p.m. to 2:00 p.m.
Marketing the Electronics Business
Doug Dixon, 360Circuits
2:30 p.m. to 3:00 p.m.
Quality Control and Calibration
Mike Sevigny, CeTaq
3:30 p.m. to 4:30 p.m.
Role of AI in Assembly
Speaker TBA
4:00 p.m. to 5:00 p.m.
Panel Training/Workforce Development
Rebecca Lewis, NextFlex; Lane Glenn, Northern Essex Community College